| 摘要 |
PROBLEM TO BE SOLVED: To provide a TFT array board reduced in manufacturing cost by decreasing the number of sheets of masks, i.e., simplifying the manufacturing process in production of the TFT array board used in a liquid crystal display panel. SOLUTION: A gate wiring metallic film, gate insulating film, semiconductor film and contact electrode metallic film 106 are formed on the front surface of the substrate 101. The contact electrode metallic film, the semiconductor film, the gate insulating film and the gate wiring metallic film are successively etched in first patterns by photolithography method. The flanks of the gate wiring metallic film patterns of the portions which constitute gate wiring and gate electrodes are oxidized to form transparent conductive films. The transparent conductive films, the contact electrode metallic film and part of the semiconductor film are successively etched in second patterns by the photolithography. |
