| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip component wherein an upper electrode layer is hardly corroded by making a gap generated on a boundary part of a protective layer and a plated layer as small as possible, in a case that resin is used for the protection layer. SOLUTION: A glass layer 35 is arranged between a plated layer 26 on an upper electrode layer 22 and a protection layer 40. Differently from the protection layer 40, the thickness of the glass layer 35 can be thinned, so that the degree of contraction and expansion due to thermal stress or the like is reduced, and a gap between the plated layer 26 and the glass layer 35 can be more reduced.</p> |
