Device for removing a flip chip die from packaging

摘要

A method and structure for accessing the circuit region on a flip chip die are provided. The method and device permit multiple portions of the circuit region to be tested and analyzed simultaneously or in sequence. Access to the circuit region is gained without deteriorating any portions of the circuit region through the process. In a similar fashion, the new method and device allow for the circuit region to be efficiently modified, or "debugged," and then returned into operation.