发明名称 |
Method and apparatus for forming a plastic chip on chip package module |
摘要 |
A method and an apparatus for forming a plastic chip on chip module is disclosed. The plastic chip on chip module is formed by placing a stacked chip set into a molding chamber suitably arranged to receive encapsulant. The stacked chip set includes a daughter chip that is electrically and mechanically coupled to a mother chip where the daughter chip is directly aligned to and separated from the mother chip by a standoff gap. Encapsulant is then passed into the molding chamber filling the standoff gap substantially simultaneously with surrounding the chip set to form the plastic chip on chip module.
|
申请公布号 |
US6238949(B1) |
申请公布日期 |
2001.05.29 |
申请号 |
US19990336037 |
申请日期 |
1999.06.18 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
NGUYEN LUU;PRABHU ASHOK;KELKAR NIKHIL;TAKIAR HEM P. |
分类号 |
H01L21/56;H01L23/31;H01L23/495;H01L25/065;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|