| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency package having a feed through, that can easily be manufactured and reduce the radiation loss. SOLUTION: The high frequency package 1 consists of a cavity 3 on which a semiconductor element 2 is mounted and the feed through 4 that interconnects the inside and the outside of the cavity 3. The feed through 4 consists of a coplanar line 4a, an inner layer line 4b, a signal conductor 5, a rear side ground conductor 6a of a 1st layer 1a, a ground conductor 6b of the coplanar line 4a and a front side ground conductor 6c of a 2nd layer 1b. An upper cover 7 air-tightly encloses the cavity 3. Via-holes 8a interconnecting the ground conductors 6a, 6b and via-holes 8b interconnecting the ground conductors 6a, 6b, 6c are formed along signal conductors in order to make the grounds in common. A semi-cylindrical metallic electrode 9 interconnecting the ground conductors 6b, 6c is formed at a connection boundary between the coplanar line 4a and the inner layer line 4b. |
