| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method for a surface mounting printed board in which generation of bubble while dipping is easily prevented without using a specific device or installation and soldering can be preformed in a high reliability. SOLUTION: This method comprises a step of providing through holes 5 by drilling for previously escaping air near assembling parts 4 in the surface on a base substrate 1, a step of immersing the assembling surface of the base substrate 1 into a dissolved solder in solder vessels 7 and 8, a step of escaping air which remains near lands 3 for assembling parts during the dipping toward the upper of the base substrate 1 via the through holes 5, and a step of preventing generation of bubble during the soldering.
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