发明名称 CUTTING APPARATUS FOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To appropriately change the cut width with no change of rotary blade and its array pitch if kind of substrates is different, and to shorten the time required for cutting/dividing a mold chip. SOLUTION: A substrate holder 5 and wheel cutter 7 which cuts a substrate 1 held with the substrate holder 5 and cuts up mold chips 2, respectively, arrayed in the XY direction on the substrate 1, are provided. The wheel cuter 7 comprises, for coaxial rotation, a first rotary blade group 7A comprising a plurality of rotary blades 37 arranged at X-direction array pitch Px of the mold chip 2, and a second rotary blade group 7B comprising the plurality of rotary blades 37 arranged at Y-direction array pitch Py of the mold chip 2. The mold chips 2 arrayed in the X-direction are collectively cut up with the first rotary blade group 7A, and then the substrate holder 5 is rotated by 90 deg. and the mold chips 2 arrayed in the Y-direction are collectively cut up with the second rotary blade group 7B.
申请公布号 JP2001144408(A) 申请公布日期 2001.05.25
申请号 JP19990321887 申请日期 1999.11.12
申请人 TAIYO DENSAN KK 发明人 YAMADA TADAO
分类号 B26D1/24;B26D1/14;B28D1/24;H05K3/00;(IPC1-7):H05K3/00 主分类号 B26D1/24
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