| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device and an electronic apparatus, in which a dedicated heat-dissipating fin is not required to be attached separately. SOLUTION: Dissipation of heat in a heat generating type semiconductor package 100 is conducted by utilizing a semiconductor chip 120 to be used as a circuit element. For this semiconductor chip 120, a multi-chip package 140 in which a plurality of chips are stacked can be used. |
