| 摘要 |
PROBLEM TO BE SOLVED: To provided a printed wiring board which reduces a level difference on the surface of an insulating layer, and also to provide a method for manufacturing the board. SOLUTION: Prior to lamination of a DFA layer 6 on a single-line pattern 3 and a solid pattern 4, only the solid pattern 4 is etched, and the thickness of the solid pattern 4 is made smaller than that of the line pattern 3. Thereafter the DFA 6 is laminated and pressed to obtain a printed wiring board. In the board, since the thickness of the solid pattern 4 is smaller than that of the line pattern 3, a level difference on the surface of the DFA layer 6 can be reduces. Accordingly, the surface of the board is substantially a flat surface.
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