| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for packaging micro electro-mechanical system(MEMS) which is built on a wafer on the smallest scale and under optimum conditions, by using current manufacturing technology before dividing it into individual chips. SOLUTION: Enclosed cavities are formed by bonding a silicon cap wafer 116 provided with cavities 115, in each of which MEMS can be housed by etching and a silicon wafer 111, on which active circuits 112 are built by a thin film 114 of glass and a cavity sidewall 125. A conductor 113 is formed of a minimum length and a bonding wire is connected to a contact pad 113a through a hole 118, when the conductor is divided and ultimately incorporated in the system. |
