| 摘要 |
The invention relates to the manufacture of semiconductor elements (10), in which manufacturing process a part of a semiconductor body (11) having a silicon substrate from which the semiconductor elements (10) are formed is removed by means of powder blasting. For this purpose, the surface of the semiconductor body (11) is provided with a mask pattern (40). The (111) crystal orientation is chosen as the crystal orientation of the substrate (32), and the longitudinal direction (M) of the mask pattern (40) is aligned with respect to the (110) crystal orientation (L) of the substrate (32) in such a manner that the removed part of the semiconductor body (11) has a symmetrical profile when viewed in cross-section. |
