| 摘要 |
PROBLEM TO BE SOLVED: To correct a characteristic variation resulting from characteristic dispersion during flip-chip mounting, if the characteristic dispersion can be found in a circuit itself of a semiconductor chip. SOLUTION: This semiconductor device comprises a mounting substrate 5 on which lands 6a, 6b are formed, a semiconductor chip 1 in which a circuit and a plurality of pads 3a to 4b are formed and that stands face to face with the mounting substrate 5, and terminal units 7a, 7b that intervene between the pads and lands. A plurality of pads include the first pad 3a, that is connected to a node of the circuit and connected to the land (for example, 6a) for the mounting in the prescribed state of the semiconductor chip 1 and the second pad 4b that is connected to a different node of the circuit and connected to the land 6a, instead of the first 3a for the mounting that is performed by varying the position and/or the angle of rotation of the semiconductor chip 1 from the prescribed state. The mounting that is performed by varying this relative position relationship changes the prescribed element impedance of the circuit to a different value and can correct the circuit characteristics. |
