| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress the increase of the test time even if the number of chips on a wafer increases, differently from a conventional method of testing the chips on the wafer one by one and marking the chips to identify good/defective products or storing information about the good/defective products. SOLUTION: In this semiconductor, the test of chip itself is carried out inside the chip, and by changing the temperature of a part of the chip or the whole chip according, the test result is made recognizable from the outside of the chip as the temperature change. By capturing the temperature changes of the chips, the good/defective products are identified.</p> |
