| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device ready for downsizing a semiconductor chip and suitable for a CSP. SOLUTION: A semiconductor device 10 has a semiconductor chip 13 having a mounting surface 11 mounted with a connection pad 12 and a film 14 which has an adhesive surface 19 opposite to the mounting surface 11 and a mounting surface 20 to a circuit board 15 mounted with a connection pad 16 at the side opposite to the adhesive surface 19. The film 14 has on the mounting surface 20 a wiring pattern 21 having a connection terminal portion 22 connected to the connection pad 16 of the circuit board 15 and is made of an anisotropically conductive film 14, whose portion receiving pressure between the wiring pattern 21 and the connection pad 12 of the semiconductor chip 13 becomes conductive, and whose adhesive surface 19 is fixed to the semiconductor chip 13 with the conductivity kept when it is cooled after heating. |
