发明名称 METHOD AND SYSTEM OF PLACING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To recognize different types of electronic components with a high precision and at a high speed. SOLUTION: A head 6 is provided with a movable line sensor 20 which is moved by a scan motor 18 for scanning electronic components 24 and recognition of components is performed. Specified cells of the line sensor 20 are selected according to the type of chucked electronic components, and signals are read out. In such a construction, scanning of the electronic components by the sensor become high-speed and the speed of placing components can be increased. Also, since signals from the sensor are read out even when the line sensor is accelerated or decelerated, scanning can be performed at a further higher speed. The speed of scanning can also be further increased by preliminarily moving the sensor to the end of the component chucked by the first chuck nozzle while components are chucked by other chuck nozzles or by setting the moving speed of the sensors between the chuck nozzles higher than that of scanning components and the tact time of component placing can be reduced.
申请公布号 JP2001144497(A) 申请公布日期 2001.05.25
申请号 JP19990320501 申请日期 1999.11.11
申请人 JUKI CORP 发明人 AIDA TAKESHI;MOROOKA HIROAKI;TAGUCHI KATSUHIKO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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