发明名称 |
Chip scale package and method for manufacturing the same using a redistribution substrate |
摘要 |
A method for manufacturing a chip scale package includes: providing a redistribution substrate; attaching a semiconductor wafer to the redistribution substrate; forming external terminals on the redistribution substrate; and separating the semiconductor wafer and the redistribution substrate into individual integrated circuits. The method can further include forming a buffer layer by filling a gap between the semiconductor wafer and the redistribution substrate with a dielectric material. Another method is the same as the method described above except that instead of the semiconductor wafer, individual integrated circuit chips attach to the redistribution substrate. Meanwhile, a semiconductor package includes: a semiconductor integrated circuit having chip pads formed thereon; interconnection bumps overlying on the chip pads; a patterned metal layer connecting to the interconnetion bumps; a first dielectric layer under the patterned metal layer; a second dielectric layer overlying on the patterned metal layer; and terminal pads connecting to the patterned metal layer. The semiconductor package can further include external terminals connecting to the terminal pads, a third dielectric layer filling a gap between the first dielectric layer and the semiconductor integrated circuit.
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申请公布号 |
US6235552(B1) |
申请公布日期 |
2001.05.22 |
申请号 |
US20000482160 |
申请日期 |
2000.01.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWON YONG HWAN;KANG SA YOON |
分类号 |
H01L23/29;H01L21/56;H01L21/60;H01L23/12;H01L23/14;H01L23/31;H01L23/485;H01L23/498;(IPC1-7):H01L21/44;H01L21/48 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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