| 发明名称 |
Paste connection plug, burying method, and semiconductor device manufacturing method |
| 摘要 |
Form a trench in a major surface of a semiconductor substrate, then bury a paste in the trench. The paste contains solids having a conductive substance and a resin, and solvent for dissolving the resin. The solids content of the paste is not less than 60 vol % and a viscosity ratio thereof is not more than 2.
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| 申请公布号 |
US6235624(B1) |
申请公布日期 |
2001.05.22 |
| 申请号 |
US19990321534 |
申请日期 |
1999.05.28 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SASAKI KEIICHI;KIMURA MANABU;HAYASAKA NOBUO |
| 分类号 |
H01L21/288;H01L21/768;H01L23/48;(IPC1-7):H01L21/476 |
主分类号 |
H01L21/288 |
| 代理机构 |
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代理人 |
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