| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate holding device which can apply a uniform pressure over the whole surface of a substrate such as a semiconductor wafer and uniformly grind the whole surface to be ground of the substrate, and a polishing apparatus provided with the substrate holding device. SOLUTION: The substrate holding device which holds the substrate W which is a work to be polished and presses it against a polishing surface on a turn table comprises a top ring body 2 for holding the substrate W, a retainer ring 6 for holding an outer peripheral edge of the substrate W, a fluid chamber 8 provided within the top ring body 2, covered by an elastic film 4 and fed by the fluid, and a plurality of pressurizing members 5A and 5B interposed between the elastic film 4 to form the fluid chamber 8 and the substrate W to apply the pressure to the substrate W via the elastic film 4. |
