| 摘要 |
PROBLEM TO BE SOLVED: To provide an sucking plate free from any gap, step or undulation, and a cutting apparatus provided with the sucking plate. SOLUTION: The sucking plate 1 is formed by integratedly baking a disk-like porous part 2 with a ring-like frame body 3 to surround the porous part 2 by the ceramic of the same material. The sucking plate 1 is free from any gap between the porous part 2 and the frame body 3, and when an upper surface thereof is ground, the grinding quantity becomes uniform and no step is formed, and since no bottom part is present in the frame body, no undulation is generated on the surface of the porous part. A chuck table 5 is formed by mounting the sucking plate 1 on the upper surface of a base 4 having a suction mechanism, and this chuck table is mounted on the cutting device. When a plate-like article such as a semiconductor wafer is sucked to and held by, and ground, the surface can be ground with high accuracy without generating any recess, step or undulation. |
