发明名称 HEAT INSULATING STRUCTURE FOR MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a heat insulating structure for a molding capable of realizing a sufficient heat insulation effect and capable of easily coping with recycling. SOLUTION: A heat insulating space is formed by ribs in this heat insulating structure for the molding, and the heat insulating structure is provided with granular members stored in the space and a holding member removably fitted to the opening section of the space to hold the granular members in the space. The granular members can be extracted from the space by removing the holding member. The granular members are resin foam beads with the grain size of 1-8 mm, for example, or the granular members different in grain size may be mixed for use, and the molding is the waterproof pan of a system bath unit.
申请公布号 JP2001140316(A) 申请公布日期 2001.05.22
申请号 JP19990244948 申请日期 1999.08.31
申请人 YAMAHA LIVINGTEC CORP 发明人 SATO HIROSHI
分类号 E03C1/20;B32B5/16;F16L59/02;(IPC1-7):E03C1/20 主分类号 E03C1/20
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