| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and a device for laser beam marking of a semiconductor wafer by which burrs on dot periphery, a thermal effect and marking dusts in the inside can be minimized and dots having a flat bottom can be easily formed. SOLUTION: These method and device are characterized in that, after reshaping a laser beam 1 emitted from a laser beam oscillator 2 to a prescribed beam diameter by a beam expander 3, the periphery of the laser beam is shielded by a mask type aperture 4 and a prescribed region of a beam center part is attenuated by prescribed transmission.</p> |
