发明名称 |
ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND ITS MANUFACTURING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide the electrolytic copper foil with carrier foil and using an organic agent in the joining-interface layer with the lower-limit peel strength between the carrier foil and electrolytic copper foil controllable and its manufacturing method. SOLUTION: This electrolytic copper foil with carrier foil is manufactured by forming a joinig-interface layer on the carrier foil surface and forming an electrolytic copper foil layer on the joining-interface layer. In this case, copper foil is used as the carrier foil, and a mixture of the organic agent and metallic particles is used in the joining-interface layer.</p> |
申请公布号 |
JP2001140090(A) |
申请公布日期 |
2001.05.22 |
申请号 |
JP19990321606 |
申请日期 |
1999.11.11 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
YOSHIOKA ATSUSHI;SUGIMOTO AKIKO;DOBASHI MAKOTO;IWAKIRI KENICHIRO;HIRASAWA YUTAKA |
分类号 |
C25C1/12;C25D1/04;C25D1/22;C25D7/06;C25D9/02;H05K1/09;H05K3/02;H05K3/38;(IPC1-7):C25D1/04 |
主分类号 |
C25C1/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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