发明名称 ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide the electrolytic copper foil with carrier foil and using an organic agent in the joining-interface layer with the lower-limit peel strength between the carrier foil and electrolytic copper foil controllable and its manufacturing method. SOLUTION: This electrolytic copper foil with carrier foil is manufactured by forming a joinig-interface layer on the carrier foil surface and forming an electrolytic copper foil layer on the joining-interface layer. In this case, copper foil is used as the carrier foil, and a mixture of the organic agent and metallic particles is used in the joining-interface layer.</p>
申请公布号 JP2001140090(A) 申请公布日期 2001.05.22
申请号 JP19990321606 申请日期 1999.11.11
申请人 MITSUI MINING & SMELTING CO LTD 发明人 YOSHIOKA ATSUSHI;SUGIMOTO AKIKO;DOBASHI MAKOTO;IWAKIRI KENICHIRO;HIRASAWA YUTAKA
分类号 C25C1/12;C25D1/04;C25D1/22;C25D7/06;C25D9/02;H05K1/09;H05K3/02;H05K3/38;(IPC1-7):C25D1/04 主分类号 C25C1/12
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