| 摘要 |
PROBLEM TO BE SOLVED: To further improve the flattening of a surface of a work to be ground. SOLUTION: A slurry guide groove 7 provided in a polishing surface 1a of a polishing pad 1 comprises spiral grooves 13a and 13b basically comprising the logarithmic spiral shape with a center of the polishing pad 1 as a starting point, and curved radial grooves 14 with the center part of the polishing pad 1 as a starting point. A plurality of spiral grooves are formed, and the spacing in the radial direction of a route is equal. The slurry guide grooves face at equal space the surface as the work, the distance of grinding fragments carried to the spiral grooves becomes uniform in the whole surface of the work. In addition, the load applied to the work during the polishing is uniformly distributed within the wafer, and the flattening of the surface of the work can be improved. Since the number of turns of one spiral groove can be reduced, the time of holding the polishing fragments within the grooves becomes appropriate by adjusting the number of the multiple grooves. |
