WAFER GRINDING HEAD, AND GRINDING APPARATUS USING IT

摘要

PROBLEM TO BE SOLVED: To provide a wafer grinding head which can detect with excellent accuracy whether or not a wafer is held, and a grinding apparatus. SOLUTION: A recessed part 7 is provided on the lower side of a carrier 16 of the wafer grinding head 11, and a flexible membrane body 9 (a flexible member) which partitions the recessed part 7 from the outside to form a second fluid chamber 8 is stretched. A communication hole 33 connected to a second pressure regulating mechanism 10 is provided substantially in a center of the recessed part 7 in the carrier 16. A differential pressure measuring device 41 to measure the differential pressure between the suction pressure of the second pressure regulating mechanism 10 and the internal pressure in the second fluid chamber at the outer circumferential part of the recessed part 7 is provided. A wafer detection device 44 to detect that the wafer W is not held by the detection of the differential pressure of the differential pressure measuring device 41 is provided.