STORAGE TRAY FOR SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a storage tray which can receive a semiconductor package in a ball grid array structure without damaging a package constituting the semiconductor package and conductive balls. SOLUTION: The storage tray 20 receives a semiconductor package 10 in a ball grid array structure with a plurality of conductive balls 12 arranged on a lower surface of a flat package 11. It includes a recess 22 provided on an upper surface of a tray body 21 which is formed to be flat for internally mounting the conductive balls 12 of the semiconductor package 10 and a plurality of clamps 24 provided in the vicinity of the recess 22 on the upper surface of the tray body 21, which are brought into elastic contact with a side face of the package 11 of the contained semiconductor package 10. Since the package 10 is contained by holding force of the clamps 24 on four sides of the package 11, the semiconductor package can be stably kept without damaging the package or solder balls.