| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device and a grinding apparatus used for this manufacturing method which prevents a semiconductor chip from breaking or cracking and suppresses the thickness variation of the semiconductor chip. SOLUTION: In relation to a grinder 22, a microwave oscillator 26 is provided for radiating a microwave nearly on the upside of a grinding pad 24, and a microwave detector 27 for detecting the microwave radiated from the microwave oscillator 26 is disposed at the bottom side of a wafer head 21. When the microwave detector 27 detects a microwave passing through a cut groove 12 in progress of grinding the downside of a semiconductor wafer W by the grinding pad 24, the ground surface of the wafer W is judged to arrive at the cut groove 12. After a specified time lapsed from the arrival of the ground surface at the cut groove 12, the backside grinding of the wafer W is ended. |
