发明名称 METHOD OF MOUNTING PARTS AND METHOD OF PRODUCING ELECTRO-OPTIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of mounting parts by which the reliability of mounting parts by using a conductive adhesive such as an anisotropic conductive film can be improved. SOLUTION: The method of mounting parts to thermally press and fix parts 11 with a conductive adhesive 12 on a substrate 3b includes a substrate heating process to heat the substrate 3b to a temperature lower by 20 to 40 deg.C than the glass transition temperature of the adhesive resin 12a included in the conductive adhesive 12 and a thermal pressing and fixing process to thermally press and adhere the parts 11 with the conductive adhesive 12 on the substrate 3b heated to that temperature.
申请公布号 JP2001133801(A) 申请公布日期 2001.05.18
申请号 JP19990313867 申请日期 1999.11.04
申请人 SEIKO EPSON CORP 发明人 UCHIYAMA KENJI
分类号 H05K3/34;G02F1/1345;G09F9/00;H01L21/60;H05K3/32 主分类号 H05K3/34
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