发明名称 |
METHOD OF MOUNTING PARTS AND METHOD OF PRODUCING ELECTRO-OPTIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting parts by which the reliability of mounting parts by using a conductive adhesive such as an anisotropic conductive film can be improved. SOLUTION: The method of mounting parts to thermally press and fix parts 11 with a conductive adhesive 12 on a substrate 3b includes a substrate heating process to heat the substrate 3b to a temperature lower by 20 to 40 deg.C than the glass transition temperature of the adhesive resin 12a included in the conductive adhesive 12 and a thermal pressing and fixing process to thermally press and adhere the parts 11 with the conductive adhesive 12 on the substrate 3b heated to that temperature. |
申请公布号 |
JP2001133801(A) |
申请公布日期 |
2001.05.18 |
申请号 |
JP19990313867 |
申请日期 |
1999.11.04 |
申请人 |
SEIKO EPSON CORP |
发明人 |
UCHIYAMA KENJI |
分类号 |
H05K3/34;G02F1/1345;G09F9/00;H01L21/60;H05K3/32 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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