| 摘要 |
PROBLEM TO BE SOLVED: To provide a III-V group compound semiconductor wafer for preventing damage from an outer boundary part of the wafer even when edge polishing is not fitted to the wafer. SOLUTION: An outer boundary part of a semiconductor wafer is so manufactured in chamfering that a rear face 3 of the wafer and a surface of the chamfering face 1 of the wafer are both non-specular and have a relation; (average surface roughness of the chamfer part 1)--(average surface roughness of the wafer surface 3) <=5μm.
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