| 发明名称 |
SPUTTERING TARGET AND METHOD FOR GRINDING SPUTTERING TARGET |
| 摘要 |
A sputtering target having a ground surface with no directionality having a surface roughness of Ra </= 0.5 mu m; and a method for grinding a sputtering target, characterized in that grinding is carried out by using a plane parallel to the rotation plane of a rotating unit, to thereby provide a ground surface with no directionality. The sputtering target can be used for preventing or reducing effectively the occurrence of cracking due to the warpage of a target itself, during transportation, mounting to a device and sputtering.
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| 申请公布号 |
WO0134870(A1) |
申请公布日期 |
2001.05.17 |
| 申请号 |
WO2000JP05173 |
申请日期 |
2000.08.02 |
| 申请人 |
NIKKO MATERIALS COMPANY, LIMITED;ARIMA, SHINICHI;ISHIZUKA, KEIICHI |
发明人 |
ARIMA, SHINICHI;ISHIZUKA, KEIICHI |
| 分类号 |
B24B39/06;C23C14/34;(IPC1-7):C23C14/34 |
主分类号 |
B24B39/06 |
| 代理机构 |
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代理人 |
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