| 摘要 |
<p>A ceramic substrate, a wafer prober, ceramic heater, and an electrostatic chuck, for use in semiconductor producing and inspecting devices, having a through-hole construction superior in resistance to pull-out force acting on an outside terminal pin. A through-hole (14) formed in a ceramic substrate (12) made mainly of aluminum nitride is formed with projections (16) projecting into the ceramic substrate (12).</p> |
