THIN FILM DEPOSITION SYSTEM

摘要

PURPOSE: A thin film deposition system is provided which enables easy controlling of fluid due to scale-up of a wafer diameter, and forms a uniformed thin film by constantly maintaining temperature of a wafer to be deposited at each parts of the wafer. CONSTITUTION: The thin film deposition system comprises a vacuum chamber(20); a block(30) which is installed inside the vacuum chamber(20); a heating means(40) which is installed in the block(30); a nozzle part(50) which is installed in the chamber(20) of the upper part of the block(30) to supply metallic organic material and gas; a gas supply means for supplying gas to the nozzle part(50); an ascent and descent means(70) for ascending or descending the block(30) to adjust between the nozzle part(50) and a wafer(100); an exhaust means(80) comprising two outlets which are symmetrically formed at the chamber(20) on the basis of the center of the block(30); and a heating and cooling means which is installed on the outer circumferential surface of the vacuum chamber(20).