EPOXY RESIN MOLDING MATERIAL FOR ELECTRONIC PARTS ENCAPSULATION, AND IC PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for electronic parts encapsulation which material makes it possible to be soldered without carrying out a specific pretreatment at the time of mounting onto a wiring board and to provide an IC package in which electronic parts are encapsulated with this material. SOLUTION: The epoxy resin molding material for electronic parts encapsulation consists essentially of (A) an epoxy resin expressed by general formula (I); (B) a compound containing in the skeleton 20 wt.% of a naphthalene ring and also having in one molecule two or more of phenolic hydroxyl groups [but excluding a compound expressed by general formula (II) (wherein (1) is an integer of 0 to 5)]; and (C) an inorganic filler, with a blend ratio of the inorganic filler being 60 volume % or more relative to the epoxy resin molding material for electronic parts encapsulation, and the IC package is such that electronic parts are encapsulated with this molding material.