| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method and a device for straightening a sputtering target/ backing plate assembly, capable of effectively straightening the distortion e.g. warp of target without causing cracking by means of equalization of the pressing force applied to a sputtering target in straightening the distortion, such as warp and deformation, occurring in the step of joining a sputtering target and a backing plate in the process of manufacturing for a target, particularly a ceramic target. SOLUTION: In the method of straightening for a sputtering target/backing plate assembly, the assembly formed by joining the sputtering target and the backing plate is straightened by means of vacuum suction.
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