| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method using a plating barrel which can form a plating film of the same thickness on each work to be plated, and its plating apparatus. SOLUTION: The plating barrel I with the works 10 to be plated thrown therein is immersed in an anode plating solution, the plating barrel I is turned in its circumferential direction while forming the works 10 to be plated as a cathode, and the electric plating is implemented while oscillating the barrel in the axial direction.
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