| 摘要 |
PURPOSE: To align a semiconductor device, having an external connection terminal which is formed by a wire to a mounting substrate for sure and easy mounting. CONSTITUTION: A manufacturing method is used to manufacture a semiconductor device, where a wire 14 with conductivity is connected electrically to an electrode terminal 12 formed on the electrode terminal formation surface of a semiconductor element 10 for erecting, and a solder bump 38 is formed at the tip part of the wire 14. In the manufacturing method, on the surface of a substrate 30, consisting of a base material having interior wetting property to solder as compared with the wire 14, a solder paste 32 is arranged in dots corresponding to the position of the tip part of the wire 14, the each solder paste 32 and the tip part of the wire 14 are aligned for heating, and the solder bump 38 is formed at the tip part of the wire 14. |
