| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a liquid resin molding material excellent in workability and humidity resistance after cured and suitable for sealing electrical parts, semiconductor chips and the like by potting or casting. SOLUTION: The liquid resin molding material comprises an aromatic episulfide compound (A) having in one molecule at least two reactive groups represented by formula (1) (wherein X is O or S and the ratio of S is at least 50 mole %; and R1-R4 are each H, halogen or an alkyl group), a glycidyl compound (B) having at least two glycidyl groups in one molecule, a liquid acid anhydride (C) and a curing catalyst (D). The ratio of functional groups in the components A, B and C is such that the amount of glycidyl groups andβ- epithiopropyl groups in total,β-epithiopropyl groups and glycidyl groups are 1.35-3.5 times, 0.5-2.2 times and 0.5-1.6 times, respectively, by equivalent of the acid anhydride groups.</p> |
