ELECTROCONDUCTIVE ADHESIVE, MOUNTED STRUCTURE, ELECTROOPTICAL DEVICE AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To obtain an electroconductive adhesive capable of securing connection stability and also suppressing the strain of a substrate involved, to provide a mounted structure using the above adhesive, to provide an electrooptical device equipped with such a mounted structure, and to provide an electronic equipment mounted with such an electrooptical device. SOLUTION: This electroconductive adhesive 12 comprises an adhesive resin 12a and electroconductive particles 12b dispersed in the adhesive resin 12a; wherein microparticles lower in elastic modulus than the solidified adhesive resin 12a are contained.