| 发明名称 |
ELECTROPLATING OF COPPER FROM ALKANESULFONATE ELECTROLYTES |
| 摘要 |
PURPOSE: To provide an improved electrolytic prescription for electrodepositing copper on the base of an electronic device and a method for using this prescription. CONSTITUTION: This prescription is a solution which contains a copper alkanesulfonate and free alkanesulfonic acid and is intended for metallization of trenches or vias of a micron or submicron size. |
| 申请公布号 |
KR20010040084(A) |
申请公布日期 |
2001.05.15 |
| 申请号 |
KR20000060340 |
申请日期 |
2000.10.13 |
| 申请人 |
ATOFINA CHEMICALS, INC. |
发明人 |
GERNON MICHAEL D.;JANNEY PATRICK;MARTYAK NICHOLAS M. |
| 分类号 |
C25D3/38;C25D5/56;C25D7/00;C25D7/12;(IPC1-7):C25D3/38 |
主分类号 |
C25D3/38 |
| 代理机构 |
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