发明名称 |
PRINTED CIRCUIT BOARD FOR MEMORY MODULE |
摘要 |
PURPOSE: A printed circuit board(PCB) for memory module is provided to allow the material management to be easily performed by selectively mounting two types of damping resistances to a single PCB. CONSTITUTION: A PCB comprises the first connection unit(30) for permitting an array resistance to be interposed between data pins(DQ0-DQ7) of a device(20) and tabs(15) of a module; the second connection unit(40) for permitting FET switches to be interposed between data pins of the device and tabs of the module; the first jumper unit(50) for enabling FET switches; and the second jumper unit(60) for enabling FET switches from an external source. The first jumper unit includes the first pad(52) connected to a pin(QFC) for enabling FET switches, the second pad(54) connected to the pin(OE) for enabling the output of the device, and the third pad(56) connected to a ground voltage(GND). The second jumper unit includes the fourth pad(62) connected to the pin(QFC) for enabling FET switches, and the fifth pad(64) connected to a tab(FETENT) connected to a module for enabling FET switches from an external source.
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申请公布号 |
KR20010038930(A) |
申请公布日期 |
2001.05.15 |
申请号 |
KR19990047113 |
申请日期 |
1999.10.28 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
KIM, SUN GIL;PARK, JEONG SIK;RYU, HYO SEOK |
分类号 |
H05K3/30;(IPC1-7):H05K3/30 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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