发明名称 METHOD FOR ETCHING LANDING PAD OF SEMICONDUCTOR DEVICE
摘要 PURPOSE: A method for etching a landing pad is to improve an etch selection rate on a lower insulating layer of the landing pad. CONSTITUTION: A landing pad(118a,118b) is connected to an active region formed between gate electrodes provided as a word line. The landing pad connected to a source region serves to reduce an aspect ratio of a buried contact hole for connecting a storage node electrode and the source region. The landing pad connected to a drain region serves to reduce an aspect ratio of a bit line contact hole for connecting a bit line and the drain region. A thermal oxide film is deposited on a substrate with the gate electrode formed, and the first photoresist pattern is formed on the substrate. A doped polysilicon film is deposited on a substrate to form a pad conductive layer, and the second photoresist pattern defining a landing pad region is formed on the pad conductive layer. The pad conductive layer is etched using the second photoresist pattern as a mask to form the landing pads.
申请公布号 KR20010038358(A) 申请公布日期 2001.05.15
申请号 KR19990046313 申请日期 1999.10.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, EUN HYEONG;SHIN, JONG HUN
分类号 H01L27/10;(IPC1-7):H01L27/10 主分类号 H01L27/10
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