发明名称 |
METHOD FOR ETCHING LANDING PAD OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method for etching a landing pad is to improve an etch selection rate on a lower insulating layer of the landing pad. CONSTITUTION: A landing pad(118a,118b) is connected to an active region formed between gate electrodes provided as a word line. The landing pad connected to a source region serves to reduce an aspect ratio of a buried contact hole for connecting a storage node electrode and the source region. The landing pad connected to a drain region serves to reduce an aspect ratio of a bit line contact hole for connecting a bit line and the drain region. A thermal oxide film is deposited on a substrate with the gate electrode formed, and the first photoresist pattern is formed on the substrate. A doped polysilicon film is deposited on a substrate to form a pad conductive layer, and the second photoresist pattern defining a landing pad region is formed on the pad conductive layer. The pad conductive layer is etched using the second photoresist pattern as a mask to form the landing pads.
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申请公布号 |
KR20010038358(A) |
申请公布日期 |
2001.05.15 |
申请号 |
KR19990046313 |
申请日期 |
1999.10.25 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, EUN HYEONG;SHIN, JONG HUN |
分类号 |
H01L27/10;(IPC1-7):H01L27/10 |
主分类号 |
H01L27/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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