发明名称 METHOD FOR MANUFACTURING TRENCH-TYPE ISOLATION LAYER USING HYDROGEN FLOW
摘要 PURPOSE: A method for manufacturing a trench-type isolation layer using hydrogen flow is provided to form the trench-type isolation layer without a void, by making a bottom of a trench filled with polysilicon so that the depth of the trench is lowered and the aspect ration of the trench is decreased. CONSTITUTION: A substrate(10) is separated into a cell region(CA) and a peripheral circuit region(PA). The respective regions are separated into an active region and a field region. A trench is formed in the field region. An insulating layer is formed on the entire surface of the substrate exposed through the trench. A part of the trench having the insulating layer is firstly buried. The buried material layer is flowed. The trench is secondly buried.
申请公布号 KR20010038051(A) 申请公布日期 2001.05.15
申请号 KR19990045859 申请日期 1999.10.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG, SU JIN
分类号 H01L21/76;(IPC1-7):H01L21/76 主分类号 H01L21/76
代理机构 代理人
主权项
地址