发明名称 |
METHOD FOR MANUFACTURING TRENCH-TYPE ISOLATION LAYER USING HYDROGEN FLOW |
摘要 |
PURPOSE: A method for manufacturing a trench-type isolation layer using hydrogen flow is provided to form the trench-type isolation layer without a void, by making a bottom of a trench filled with polysilicon so that the depth of the trench is lowered and the aspect ration of the trench is decreased. CONSTITUTION: A substrate(10) is separated into a cell region(CA) and a peripheral circuit region(PA). The respective regions are separated into an active region and a field region. A trench is formed in the field region. An insulating layer is formed on the entire surface of the substrate exposed through the trench. A part of the trench having the insulating layer is firstly buried. The buried material layer is flowed. The trench is secondly buried.
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申请公布号 |
KR20010038051(A) |
申请公布日期 |
2001.05.15 |
申请号 |
KR19990045859 |
申请日期 |
1999.10.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HONG, SU JIN |
分类号 |
H01L21/76;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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