| 摘要 |
PROBLEM TO BE SOLVED: To improve the mounting efficiency of an IC chip by mounting as many IC chips as possible at a time on each of a plurality of circuits formed on a substrate in multi-plane arrangement. SOLUTION: A plurality of circuits 2 are formed on a substrate 1, and an IC chip 4 is arrange, via an IC chip mounting adhesive 3, at each of IC chip expected positions of the plurality of circuits 2. A heating plate 5, which is so wide as to cover the entire arranged IC chips 4 is provided over the IC chips 4, and the IC chips 4 are collectively mounted on the circuit 2 under the heat from the heating plate 5. |
