| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, which is high in reliability, can be miniaturized, can be reduced in its manufacturing cost and has substrates which are respectively provided with a recessed part for mounting a semiconductor element. SOLUTION: A drawable wiring body, which is constituted of copper wirings 12 which are used as wiring members, a barrier layer 11, such as a nickel alloy layer, and a copper foil 10, which is used as a carrier layer, is bonded to resin substrates 14 and 15 and at the same time, the wiring body is subjected to press processing by the projection part 13a of a metal mold 13, whereby with wirings 2 buried in the surfaces of the substrates formed, steps are provided between semiconductor elements 1 constituting both end parts of the wirings 2 and inner connection terminal parts, which are connected with the elements 1, and between external connection terminals 5 and external connection terminal parts, which are connected with the terminals 5, whereby recessed parts capable of housing the elements 1 are formed in the central parts of the said substrates. |
