| 摘要 |
PROBLEM TO BE SOLVED: To realize excellent high-frequency characteristics and heat characteristics of a high-frequency module and a high-frequency circuit board suitable for thinning, and to reduce their cost as well. SOLUTION: A thin-film resin board made from a polyimide is used as material for a base material 15, in a high-frequency module having a high-frequency circuit component 33 mounted on the base material 15 fitted with a wiring layer containing distributing wires 36, 37 for a high-frequency circuit formed at least on the upper surface of the base material 15. |
