| 摘要 |
PROBLEM TO BE SOLVED: To sufficiently increase the treatment speed of a vacuum treatment apparatus so that replacement of treated substrates and untreated substrates does not become a rate-determining stage in the whole work. SOLUTION: There are provide a plurality of vacuum treatment chambers 2A, 2B,..., 2G positioned in the outer periphery of a vacuum conveyer chamber 3, a load-lock chamber 1 which is positioned in the outer periphery of the vacuum conveyer chamber 3 and has a vacuum-side opening 1a and atmosphere-side opening 1b and a substrate supply device 40 which conveys untreated substrates into the load-lock chamber 1 and conveys treated substrates out of the load-lock chamber 1. The substrate supply device 40 is provided with at least three supply valve bodies 41 which have a holding mechanism 42 for holding a substrate and can air-tightly close the atmosphere-side opening 1b, and a supply valve body drive device 43 for successively moving at least three supply valve bodies among a position P1 opposed to the atmosphere-side opening 1b, position P2 at which a treated substrate is removed and position P3 at which untreated substrate is received. |
