| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus, which prevents reaction products from depositing to the exhaust piping inner wall in a low-cost and easy constitution and reduced the load of a final exhaust gas treating mechanism to improve elimination efficiency. SOLUTION: This semiconductor manufacturing apparatus 100 comprises a manufacturing chamber 11, into which various kinds of gases are supplied, a gas exhaust piping 12 makes the exhaust gas flow after reaction in the chamber 11 and finally guides it to an exhaust gas treating mechanism 13, such as scrubber or elimination unit, the gas exhaust piping 12 has a sub-piping 14 covering the piping outer surface by a prescribed length, its one end is connected to a hot exhaust pipe 15 for exhausting hot gas produced in the chamber 11, and the other end is a hot exhaust gas outlet EXH. The gas exhaust piping 12 of the inner pipe is thermally insulated or heated to keep the exhaust gas flowing in the gas exhaust piping 12 at nearly the temperature immediately after being exhausted from the chamber 11, thereby suppressing reaction products from generating.
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