PRINTED WIRING BOARD AND METHOD OF MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board in which accuracy is enhanced at the interlayer connecting part while increasing the density and the number of layers. SOLUTION: The printed wiring board is manufactured by forming conductive paste, an insulating resin layer and a circuit conductor through build-up without boring the interlayer connecting part of a multilayer printed wiring board by drilling or laser machining.