| 发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD |
| 摘要 |
PROBLEM TO BE SOLVED: To minimize contact resistance of a conductive plug which connects one wiring layer with an upper next wiring layer in a semiconductor device having a multilayer wiring structure. SOLUTION: An enlarged part is formed in the base part of a conductive plug.
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| 申请公布号 |
JP2001127151(A) |
申请公布日期 |
2001.05.11 |
| 申请号 |
JP19990304631 |
申请日期 |
1999.10.26 |
| 申请人 |
FUJITSU LTD;TOSHIBA CORP |
发明人 |
FUKUDA MASATOSHI;SUZUKI HISAYA;KATADA TOMIO;NAKAMURA NAOFUMI |
| 分类号 |
H01L21/768;H01L23/522;(IPC1-7):H01L21/768 |
主分类号 |
H01L21/768 |
| 代理机构 |
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