| 发明名称 |
SUBSTRATE WITH FEEDTHROUGH AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
<p>A substrate used for a package of a microdevice has flat front and back surfaces and a wiring extending between the surfaces and conduct electricity between the surfaces through the wiring.</p> |
| 申请公布号 |
WO0132555(A1) |
申请公布日期 |
2001.05.10 |
| 申请号 |
WO2000JP07556 |
申请日期 |
2000.10.27 |
| 申请人 |
JAPAN SCIENCE AND TECHNOLOGY CORPORATION;ESASHI, MASAYOSHI |
发明人 |
ESASHI, MASAYOSHI |
| 分类号 |
B81C99/00;H01L21/48;H01L21/68;H05K1/11;H05K3/06;H05K3/40;(IPC1-7):B81C5/00 |
主分类号 |
B81C99/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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