发明名称 Thin film semiconductor device, method for fabricating the same and semiconductor device
摘要 A thin film semiconductor device includes: a substrate having an insulating surface; a semiconductor layer containing silicon and germanium formed on the substrate; a gate insulating film formed on the semiconductor layer; and a gate electrode formed on the gate insulating film, wherein the gate insulating film includes a thermal oxide film formed by thermally oxidizing a surface of the semiconductor layer.
申请公布号 US6228692(B1) 申请公布日期 2001.05.08
申请号 US19990359207 申请日期 1999.07.22
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TSUTSU HIROSHI
分类号 H01L29/78;H01L21/28;H01L21/336;H01L29/49;H01L29/786;(IPC1-7):H01L21/00 主分类号 H01L29/78
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